Samsung Electronics strikes $200 billion Broadcom AI chip partnership

Samsung Electronics announced a memorandum of understanding with Broadcom for expanded cooperation across memory chips, contract chip manufacturing and advanced packaging, with the collaboration envisaged to exceed $200 billion until 2030. The deal includes production of Broadcom’s next-generation communications chips on Samsung’s sub-2-nanometre process and joint work on next-generation high-bandwidth memory. The partnership strengthens Samsung’s foundry position in the growing market for custom AI accelerators.